Description
Chemical composition (nom.)
– Cu 81-85%
– Sn 6-8%
– Pb 5-8%
– Zn 2-5%
Max impurities
– Ni 2.0 (can be part of the Cu-content)
– Mn 0.2%
– P 0.05%
– Sb 0.2%
– S 0.1%
– Other 0.1%
Mechanical properties
Yield strength (Rp N/mm²): ≥ 120 N/mm²
Tensile strength (Rm N/mm²): ≥ 260 N/mm²
Elongation in % A5: ≥ 12%
Hardness/Brinell: ≥ 70 HB
Density ∼ 8.8
Mating material: Min. surface hardness 200HB. Rec. surface roughness < 1 Ra
Characteristics                                                                                                         The material is not suitable for welding (lead content). The material is suitable for soldering and brazing. The material is also suitable for bonding.
